With the surging demand for training and inference of AI large models, intelligent computing centers are rapidly evolving toward high density and high power. The power consumption of a single cabinet has exceeded 150kW, and the new generation of GPU chips are stepping into the 3000W era. Drawing on forward-looking technical layout and years of experience in industrial thermal dissipation, Far East Electric stands out with innovative bionic liquid cooling technology, delivering efficient and reliable thermal management support for global AI infrastructure construction.

Traditional air cooling has reached its physical limit and fails to deliver effective temperature control for chips with heat generation above 2000W. Although the industry is generally shifting to liquid cooling, prevailing single-phase cold plates still face inherent drawbacks. Their heat dissipation capacity is generally capped at 1000W, insufficient to meet the thermal demands of high-power GPUs. Meanwhile, most solutions only focus on cold plates, accompanied by prominent challenges including high thermal interface resistance, poor component compatibility and fragmented system design. Furthermore, iterative advanced packaging technologies lead to increasingly sophisticated chip structures, imposing stricter requirements on process compatibility and customization capability of thermal solutions. Conventional standardized products can hardly adapt to diversified computing platforms.

To address the prevailing thermal challenges across the industry, Far East Electric breaks the design boundaries of conventional liquid cooling and launches an integrated liquid cooling solution featuring "bionic manifold microchannel cold plate + liquid metal TIM composite material". Inspired by the hierarchical distribution of plant veins and blood vessels in nature, the solution constructs multi-stage tapered flow equalization channels and local re-development structures. It enables rapid and even distribution of coolant underneath chips, greatly enhancing convective heat transfer while effectively lowering system pressure drop and pump power consumption. Combined with high thermal-conductivity liquid metal interface composite materials, an embedded collaborative thermal channel is formed to fundamentally reduce thermal interface resistance, efficiently extract heat from high-temperature zones of chips and significantly mitigate temperature difference across surfaces. Compared with mainstream single-phase cold plates with a maximum cooling capacity of 1000W, Far East Electric’s liquid cooling solution achieves upgraded performance with lower pump energy consumption. It fully supports heat dissipation for GPUs with power exceeding 2000W. Under 2300W load, it can reduce temperature by over 40°C versus traditional thermal solutions while maintaining excellent temperature uniformity, effectively restraining hotspot failure and performance degradation.

In terms of product adaptation and commercial deployment, Far East Electric liquid cooling plates support customized development for mainstream computing architectures including Hopper and Blackwell. They are widely applied in GPU/CPU liquid cooling accelerator cards, data center servers, high-power power electronics, RF chips and other key fields. The products feature favorable compatibility with advanced packaging processes and engineering feasibility for mass production. Beyond core liquid cooling plates, Far East Electric has built a full-stack liquid cooling product portfolio covering chip-level thermal interface materials and rack-level liquid-liquid CDU. The rack-mounted liquid-liquid CDU adopts a standard 4U rack design, equipped with redundant dual pumps and liquid leakage detection. It forms a collaboratively optimized complete set with liquid cooling plates for integrated delivery, solving industry pain points such as fragmented solutions and poor component matching, and providing customers with one-stop thermal management services from chips to racks.

With continuous expansion of the intelligent computing industry and further rising power consumption of computing chips, liquid cooling will become standard configuration for AIDC infrastructure. The industry will put forward higher requirements on energy efficiency, reliability and customization capability of thermal solutions. Going forward, Far East Electric will continue to deepen research in thermal management. Centered on heat dissipation demands for higher power density, the company will iterate manifold microchannel technologies, optimize performance of interface materials and continuously lift the ceiling of heat dissipation capacity. Meanwhile, R&D and technical reserves of cutting-edge technologies such as immersion liquid cooling will be promoted to improve the full-scenario liquid cooling product portfolio.