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Rack-Level Coolant Manifold

Designed for liquid-cooled AI racks, the Rack-Level Coolant Manifold provides reliable and balanced coolant distribution across multiple server nodes. Its modular architecture, low flow imbalance, and service-friendly connections support fast deployment, simplified maintenance, and consistent rack-level cooling performance.

Core Advantages

  • Compact Rack-Level Integration: Designed for installation within 1U–2U rack space to support independent rack deployment
  • Balanced Coolant Distribution: Optimized piping topology keeps branch-flow non-uniformity below 10%, reducing hot-spot risk across the rack
  • Service-Friendly Connections: Diamond-copper composite material with 700–900 W/m·K thermal conductivity helps suppress localized hot spots
  • Clean, Reliable Construction:304 stainless steel and EPDM components undergo deionized-water flushing, drying, and factory pressure testing for dependable operation

Application Scenarios

  • Rack‑Level Coolant Distribution

  • High-Density AI Racks

  • GPU Clusters

Key Technology Partner in the Global Field of AI Infrastructure and Intelligent Interconnection

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