Structured Liquid Metal TIM
Designed for high-power processors and AI accelerators, Structured Liquid Metal TIM creates an
ultra-low-resistance thermal path between the chip and heat sink. Its supported liquid-metal structure
combines excellent surface conformity with improved material control, enabling efficient and reliable heat
transfer in high-heat-flux computing applications.
Core Advantages
- High Thermal Conductivity:Delivers 60–100 W/m·K thermal conductivity with interface thermal
resistance as low as 0.04 K·cm²/W
- Controlled Phase-Change Performance:Configurable melting point enables solid-state handling
and liquid-state operation for improved interface conformity and material control
- Low Assembly Pressure:Requires ≤10 psi mounting pressure, helping reduce mechanical stress
on high-value chips and packages
- Long-Term Stability:Resists drying, aging, and volatilization for reliable operation across
demanding temperature and workload conditions
Application Scenarios
AI Servers
AI Accelerators
HPC Systems
High-Power CPUs&GPUs&ASICs
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