XPO Optical Module Liquid-Cooling Solution
Designed for high-density optical interconnects in AI data centers, the XPO Optical Module Liquid-Cooling Solution provides precise thermal management for high-speed optical modules. Independent flow paths and advanced heat-spreading structures improve temperature uniformity and reliability for next-generation high-bandwidth networking systems.
Core Advantages
- Independent Dual-Sided Cooling: Separate upper and lower coolant paths enable targeted thermal control across optical-module surfaces
- Enhanced Microchannel Heat Transfer:Turbulence features and stepped channels can improve the heat-transfer coefficient by more than 20%
- High-Conductivity Heat Spreading:Diamond-copper composite material with 700–900 W/m·K thermal conductivity helps reduce spreading resistance and hot spots
- Flexible Flow-Path Integration:Total flow resistance of ≤60 kPa helps improve coolant-distribution efficiency
- Comprehensive Reliability Validation: Multiple channel orientations support complex optical-module layouts and system-level mechanical requirements
Application Scenarios
12.8T Optical Systems
High-Density Networking
AI Training Clusters
AI Data Centers
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