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OAM GPU Liquid-Cooling Module

Designed for OAM GPUs in AI training and HPC platforms, this liquid-cooling module provides targeted cooling for the GPU core and memory regions. Dedicated cold-plate cooling and optimized coolant distribution enable stable thermal performance under sustained high-heat-flux workloads.

Core Advantages

  • Dedicated GPU Cold Plates:Each GPU is cooled through an independent microchannel cold plate to improve thermal consistency across multi-GPU systems
  • High-Density Microchannels:100 μm-class channels provide increased heat-transfer area for GB300-class thermal loads
  • High-Pressure Reliability:Brazed, corrosion-resistant construction withstands up to 10 bar for demanding data-center environments
  • Balanced Multi-GPU Cooling:Parallel coolant distribution minimizes card-to-card temperature variation during sustained AI workloads

Application Scenarios

  • Supercomputing

  • AI Training Clusters

  • High-Density GPU Servers

  • HPC Systems

Key Technology Partner in the Global Field of AI Infrastructure and Intelligent Interconnection

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