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Ultra-High-Performance OAM GPU Liquid-Cooling Module

Designed for high-heat-flux chips, the Structured Biomimetic Manifold Microchannel uses a vascular-inspired flow architecture to distribute coolant uniformly across large heat-source areas. Low flow resistance and enhanced heat transfer help improve temperature uniformity and cooling performance for advanced AI and high-performance computing applications.

Core Advantages

  • 2,300 W-Class Cooling Capacity:Engineered for next-generation OAM GPUs with extreme thermal loads
  • High-Efficiency Microchannel Cooling:Optimized cold-plate channels deliver rapid heat removal from critical GPU regions
  • Low Thermal Resistance:Efficient chip-to-coolant heat transfer helps maintain lower operating temperatures under sustained workloads
  • Stable Full-Load Performance:Uniform coolant distribution and balanced temperature control support long-duration AI training and HPC operation

Application Scenarios

  • Hyperscale AI Data Centers

  • Large-Scale AI Training

  • High-Density GPU Servers

  • HPC Systems

Key Technology Partner in the Global Field of AI Infrastructure and Intelligent Interconnection

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