CPU + DIMM Liquid-Cooling Module
Designed for high-density server CPUs and memory, this integrated liquid-cooling module provides coordinated thermal management for CPU and DIMM regions. Precision cold-plate cooling, reliable sealing, and integrated leak detection help maintain stable operation in AI, cloud, and high-performance computing environments.
Core Advantages
- Precise CPU Thermal Control:At 1.2 L/min coolant flow and 50°C operating conditions, CPU case temperature is maintained at ≤65°C with ≤3°C temperature variation
- Precision Cold-Plate Interface:Contact-surface flatness of ≤0.05 mm supports efficient and consistent heat transfer
- Integrated Leak Detection:Built-in leak-detection capability enables early identification of coolant-loop risks
- Validated Reliability: Pressure, leakage, vibration, thermal-cycling, salt-spray, and drop testing support dependable data-center operation
- Environmental Compliance:Materials are designed to meet RoHS 2.0 and REACH requirements
Application Scenarios
High‑Density Servers
AI Training & Inference
High-Density GPU Servers
HPC Systems
中文
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