External High-Speed Cable Assemblies
Designed for high-bandwidth rack-to-rack and device-to-device connectivity, these external cable assemblies support 8 × 112 Gbps channels for up to 800G transmission. Low-latency, low-power connectivity and standard high-density interfaces provide a scalable interconnect solution for AI clusters, data centers, switches, and HPC platforms.
Core Advantages
- Up to 800G Bandwidth:Eight 112 Gbps channels provide high-capacity connectivity for AI clusters and hyperscale data centers
- Strong Signal Integrity:Optimized cable construction reduces insertion loss and crosstalk for stable short-reach transmission
- Low-Power Plug-and-Play Deployment:Passive or low-power architecture simplifies installation and reduces power overhead
- High-Density Standard Interfaces: QSFP/OSFP compatibility supports dense rack cabling and scalable system integration
Application Scenarios
Servers/Storage Devices
High-Performance Computing
Data Centers
Switches
5G Base Stations
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