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Server-Level Coolant Manifold

Designed for direct-liquid-cooled AI servers, the Server-Level Coolant Manifold provides uniform coolant distribution to multiple cold plates and thermal components within the server. Precision construction, reliable sealing, and service-friendly connections support efficient integration, maintenance, and large-scale deployment of high-density computing systems.

Core Advantages

  • Precision Mechanical Integration: Flatness <0.2 mm and perpendicularity <0.1 mm support reliable blind-mate installation
  • Balanced Server-Level Flow:Optimized internal flow paths keep branch-flow non-uniformity below 10% for consistent component cooling
  • Service-Friendly QD Interfaces:Standard non-spill quick disconnects enable fast installation and maintenance
  • Clean, Corrosion-Resistant Construction:304 stainless steel and EPDM components undergo deionized-water cleaning, drying, and pressure testing before shipment

Application Scenarios

  • AI Data Centers

  • Large-Scale Coolant Distribution

  • HPC Facilities

Key Technology Partner in the Global Field of AI Infrastructure and Intelligent Interconnection

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