Switch Liquid-Cooling Solution
Designed for high-performance switching platforms in AI clusters, the Switch Liquid-Cooling Solution delivers efficient heat removal for high-power switching ASICs beyond conventional air-cooling limits. Advanced microchannel cooling and high-performance heat spreading help maintain stable network performance in dense 400G/800G and next-generation switching environments.
Core Advantages
- 1,200 W+ ASIC Cooling:Extends thermal capability beyond conventional air-cooling limits for next-generation switching silicon
- High-Performance Biomimetic Microchannels: maintaining low flow resistance, improving cold-plate cooling capacity by up to 150%
- Advanced Heat Spreading:Diamond-copper composite material with 700–900 W/m·K thermal conductivity helps suppress localized hot spots
- Ultra-Low-Resistance Thermal Path:Structured liquid-metal interface technology can reduce chip temperature rise by up to 65% and support heat sources in the 2,500 W class
Application Scenarios
High-Performance Switching
400G/800G Switches
AI Cluster Networking
Data Center Networks
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