CPU + GPU + VR Liquid-Cooling Module
Designed for high-density AI servers and HPC platforms, this multi-chip liquid-cooling module provides coordinated cooling for CPUs, GPUs, and voltage-regulation components. Its integrated cold-plate architecture enables efficient heat removal across multiple high-power devices, supporting sustained full-load performance and reliable server operation.
Core Advantages
- High Thermal-Load Capacity: Supports a 550 W CPU plus four 500 W GPUs under full load, with CPU case temperature ≤55°C and GPU temperature ≤75°C
- 10 Bar Pressure Rating: Designed for demanding liquid-cooling environments with typical operating pressure around 3.5 bar
- Precision Thermal Interface: Primary chip contact-surface flatness of ≤0.05 mm supports efficient heat transfer across multiple devices
- Low System Flow Resistance: Total flow resistance of ≤60 kPa helps improve coolant-distribution efficiency
- Comprehensive Reliability Validation:Pressure-hold, pressure-pulse, thermal, flow, leakage, and environmental testing support long-term operation
Application Scenarios
Multi-GPU AI Servers
HPC Systems
AI Training Clusters
AI Data Centers
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