From September 2 to 4, 2026, the Open Data Center Conference & 1st Computing Expo (ODX) was held in Beijing. Centered on the theme of “Open AI Infra, Empowering Inclusive Computing Power”, the event gathered leading enterprises across the global computing‑power industrial chain to discuss innovations in computing infrastructure and large‑scale application of liquid‑cooling technologies.

During the conference, Far East Electric showcased its full‑stack AIDC liquid‑cooling solution at Booth A68. From 10:20‑10:40 on September 4, Lü Fangyu, Senior Solution Director of Far East Electric, delivered a keynote speech at the main forum. Focusing on “Breakthroughs in Dual‑New Liquid‑Cooling Technology: Jet Micro‑channel and Liquid‑metal Empower High‑density Intelligent Computing”, she shared Far East Electric’s technical explorations and engineering practices in liquid‑cooling for high‑density intelligent computing.

Far East Electric’s Booth A68 drew large crowds with numerous guests stopping for exchanges

Far East Electric Dual‑New Liquid‑Cooling, Full‑stack Coverage

Chip‑level: At this exhibition, Far East Electric presented an integrated “Dual‑New” solution combining bionic manifold micro‑channel cold plate and structured liquid‑metal TIM.

Inspired by the hierarchical distribution of human blood vessels and plant leaf veins, the bionic structure adopts multi‑stage tapered uniform‑flow channels for even coolant distribution. Under a 2300W load, it achieves over 40℃ lower temperature compared with conventional cooling solutions.

Liquid‑cooling products displayed at Far East Electric’s Booth A68

Server‑level: Far East Electric supplies a full portfolio of in‑server liquid‑cooling modular components including CPU, DIMM, GPU and manifold assemblies. It meets heat dissipation requirements of core heat‑generating devices, supports holistic liquid‑thermal solutions, and fits high‑density computing deployment scenarios in data centers.

Liquid‑cooling products displayed at Far East Electric’s Booth A68

System‑level: Rack‑mounted / cabinet‑type liquid‑cooling CDU covers heat exchange capacity from 16 kW to 2000 kW with overall heat‑exchange efficiency of 96%‑98%. It helps bring the PUE of intelligent computing centers below 1.15, with temperature control accuracy within ±0.5℃, dual‑power switching shorter than 100 ms, and N+1 full redundancy for core components.

Far East Electric Full‑chain Independent R&D, One‑stop AIDC Delivery & Implementation

At the exhibition, Far East Electric’s technical team conducted in‑depth one‑on‑one communications with customers and provided consulting on customized liquid‑cooling solutions. Evolving from a single‑product supplier to a full‑stack thermal management comprehensive solution provider, it delivers one‑stop implementation covering chips, cabinets and computer rooms, with all core components independently developed.

Far East Electric’s full‑stack AIDC liquid‑cooling solution has been deployed and validated in multiple computing‑power center projects.

Far East Electric Three Core AIDC Solutions

The full‑stack liquid‑cooling solution spans chip‑to‑room level, supporting ultra‑high‑density computing clusters of 30 kW‑300 kW+ per rack. It achieves 96%‑98% overall heat‑exchange efficiency and helps lower PUE below 1.15.

The full‑stack high‑speed interconnection solution establishes direct chip‑to‑chip links, covering full‑scenario networking including Scale‑Up intra‑cabinet vertical expansion, Scale‑Out inter‑rack horizontal expansion and Scale‑Across cross‑data‑center interconnection, to fully unlock performance of high‑density computing clusters.

The power transmission & distribution solution offers a complete range of low‑voltage, medium‑voltage, communication and waterproof cables, underpinning power transmission infrastructure for computing facilities.

The three solutions form a complete closed‑loop for AIDC infrastructure. With all core components self‑developed, one‑stop delivery is realized from chips through cabinets to computer rooms.

Looking ahead, Far East Electric will keep focusing on core technical innovations for AI infrastructure. Together with industrial‑chain partners, the company will build more efficient, reliable and sustainable intelligent‑computing infrastructure for global customers and jointly unlock boundless potentials of the intelligent era.