With the exponential expansion of AI large‑model training and inference workloads, power density per cabinet in intelligent computing centers has surged from traditional tens of kilowatts to the hundred‑kilowatt level, while power consumption of new‑generation GPU chips keeps climbing to higher thresholds. Computing infrastructure is confronted with unprecedented thermal management challenges. Riding on this industry trend, Far East Electrical has deep expertise in liquid‑cooling thermal‑management technologies and launched cabinet‑mounted liquid‑to‑liquid CDU products. It delivers mature and efficient centralized liquid‑cooling solutions for diversified scenarios including high‑density data centers, AI training clusters and supercomputing computer rooms. Its integrated design and intelligent control lay a solid thermal‑management foundation for the high‑density computing era.

At present, thermal density per cabinet for AI training clusters and high‑density data centers keeps rising. Conventional air cooling has gradually hit its efficiency ceiling. It can hardly satisfy precise temperature‑control requirements under high thermal loads, and brings a series of issues such as excessive cooling‑energy consumption, excessive computer‑room noise and server hotspot frequency throttling, which directly restrict computing output efficiency and PUE optimization. Traditional deployment of distributed liquid‑cooling components features long construction cycles and creates fragmented‑management challenges for later‑stage operation and maintenance. Meanwhile, liquid‑cooling systems are plagued by common industry challenges including pipeline corrosion, difficulty in maintaining working‑fluid cleanliness, challenges in liquid‑leak risk control and high professional thresholds for operation and maintenance. Assembled products from some manufacturers lack core temperature‑control algorithms and complete safety‑protection systems, and may suffer deteriorated heat‑exchange efficiency and intensified leakage risks over long‑term operation. How to guarantee heat‑dissipation efficiency while taking care of system reliability and operation‑maintenance efficiency has become a core challenge for large‑scale deployment of liquid cooling in data centers.

To address multiple existing thermal‑pain points across the industry, Far East Electrical’s cabinet‑mounted liquid‑to‑liquid CDU adopts an integrated design that can be installed side‑by‑side with server cabinets. Core components such as plate heat exchangers, secondary‑loop circulating pumps, pressure‑stabilizing fluid‑make‑up systems, expansion tanks, filters, valves, sensors and control systems are highly integrated inside a standard cabinet. A complete Coolant Distribution Unit can be formed without distributed deployment, substantially lowering deployment difficulty and space occupation. It is especially suitable for liquid‑cooling retrofits of legacy computer rooms and minimizes modifications to existing computer‑room layouts. Equipped with high‑efficiency variable‑frequency pumps with optional single‑pump and dual‑pump configurations, the dual‑pump mode supports 1+1 cold‑standby redundancy. Together with dual‑power‑supply backup design, it guarantees 7×24‑hour uninterrupted system operation from both power‑dynamics and power‑supply dimensions, completely eliminating computing‑interruption risks triggered by single‑component failures. Its flow‑rate adjustment ranges from 10 % to 100 %. It dynamically matches cooling output according to fluctuations in computing load, realizes low‑energy‑consumption operation while ensuring temperature‑control accuracy, and helps data centers continuously optimize PUE performance.

As an important component of Far East Electrical’s full‑stack liquid‑cooling product portfolio, the cabinet‑mounted liquid‑to‑liquid CDU works in synergy with self‑developed biomimetic‑manifold micro‑channel liquid cold plates and liquid‑metal thermal‑interface materials to deliver optimized complete‑set solutions. It realizes integrated thermal‑management services from chip‑level to cabinet‑level, effectively solving industry pain points such as fragmented solutions and poor cross‑vendor component compatibility. It provides customers with one‑stop liquid‑cooling experience featuring overall delivery and unified operation‑maintenance. Widely applicable to high‑density data centers, retrofitted and new‑build intelligent computing centers, large‑scale computer rooms and AI training clusters, the product fully meets heat‑dissipation demands of computing infrastructures of varying power levels and builds a stable and reliable thermal‑dissipation hub for high‑density computing infrastructures.

With continuous advancement of the intelligent‑computing industry, liquid‑cooling technology will become the standard cooling solution for next‑generation data centers. Going forward, Far East Electrical will continue to deepen thermal‑management technology research. It will iterate core heat‑exchange technologies and optimize temperature‑control algorithms and system energy efficiency to break upper limits of heat‑dissipation capacity in response to higher‑power‑density cooling demands. Meanwhile, it will advance R&D and technical reserves for cutting‑edge technologies such as immersion liquid cooling, and continuously improve the full‑scenario liquid‑cooling product matrix covering chip‑level, cabinet‑level and computer‑room‑level scenarios. It will respond to differentiated requirements from diverse customers with richer product forms and more mature system solutions.