The 2026 Asia Data Center Summit was held in Hong Kong from July 8 to 9. Far East Electric made a stunning appearance with its full-stack "Electric Energy + Computing Power + AI" solutions. It showcased a full range of self-developed cutting-edge thermal control technologies including bionic dual-new liquid cooling plates, GB300 liquid cooling systems, CDUs and liquid metal TIM materials, realizing two-way coordination of "high-speed interconnection and high-efficiency thermal management", and fully demonstrating its technological strength and innovative achievements under the strategic layout.

Currently, demand for training and inference of large AI models is exploding. The power consumption of a single cabinet in intelligent computing centers has exceeded 150kW, while the power of new-generation GPU chips is stepping into the 3000W era. Traditional air cooling can no longer meet extreme heat dissipation requirements, making liquid cooling a standard solution for intelligent computing centers. Meanwhile, energy consumption ratio, temperature uniformity, reliability of cooling systems and their coordination with high-speed interconnection systems have become core bottlenecks restricting the large-scale deployment of AIDCs. The industry is in urgent need of full-stack thermal management solutions compatible with next-generation chips that balance performance and energy efficiency.

At the exhibition, Far East Electric presented its core self-developed liquid cooling solutions. The integrated solution combining "bionic manifold microchannel cold plate and thermal interface composite material" can handle heat dissipation for GPUs with power over 2000W, featuring low energy consumption and excellent temperature uniformity. It is compatible with next-generation core equipment and helps AIDCs optimize PUE. Meanwhile, as a supporting arm of the group, Far East Communications brought high-speed interconnection products tailored for AIDC scenarios. Leveraging advanced industry processes, it has realized mass production of G.657.A1/A2 optical fibers. Its multimode optical fibers perfectly satisfy the low-latency and high-bandwidth requirements of AI training clusters, and sufficient production capacity delivers stable support for high-speed interconnection in AIDCs. The bionic manifold microchannel dual-new liquid cooling plates can reduce temperature by over 40°C under a 2300W load compared with traditional heat dissipation solutions, support customized development for Hopper and Blackwell platforms, and adapt to the construction of various AI computing centers. The integrated complete solution enables turnkey delivery and collaborative optimization, effectively solving long-standing industry pain points such as fragmented solutions and poor component compatibility.

At this Asia Data Center Summit, Far East Electric displayed high-speed interconnection products and liquid cooling solutions simultaneously with deep integration, forming full-scenario advantages of "lag-free high-speed interconnection and downtime-free efficient heat dissipation". From high-speed transmission of optical signals to efficient heat removal from equipment, from product R&D to mass production, Far East has opened up the core AIDC "interconnection-heat dissipation" chain through internal resource coordination, addressing industry pain points and demonstrating its firm commitment to deep cultivation in the AIDC track.

In the future, Far East Electric will further deepen its "Electric Energy + Computing Power + AI" strategic layout and improve its product and service system for the AIDC sector. Relying on its globally integrated R&D, manufacturing, sales, service and supply chain system, the company will rapidly respond to industrial demands, facilitate the development of the AIDC industry toward higher efficiency, environmental friendliness and synergy, and deliver solid support for the high-quality development of the digital economy.