From September 2 to 4, 2026 Open Data Center Conference & 1st Computing Expo (ODX) was held in Beijing. With the theme of “Open AI Infra, Empower Inclusive Computing Power”, the conference gathered leading enterprises across the global computing power industrial chain to discuss innovations in computing infrastructure and large-scale application of liquid cooling technology.

During the event, Far East Electric showcased its full-stack AIDC liquid cooling solutions at Booth A68. From 10:20 to 10:40 on September 4, Lü Fangyu, Senior Director of Solutions at Far East Electric, delivered a keynote speech at the main forum themed “Breakthroughs in Dual-New Liquid Cooling Technology: Jet Microchannel and Liquid Metal Empower High-Density Intelligent Computing”, sharing Far East Electric’s technical exploration and engineering practices in liquid cooling for high-density intelligent computing.

Far East Electric’s Booth A68 attracted heavy foot traffic with many guests stopping for exchanges

Far East Electric Dual-New Liquid Cooling, Full-Stack Coverage

Chip-level: At this exhibition, Far East Electric launched an integrated "Dual-New" solution combining bionic manifold microchannel cold plates and structured liquid metal TIM.

Inspired by the hierarchical distribution of human blood vessels and plant veins, the bionic structure adopts multi-stage tapered flow-equalizing channels for even coolant distribution. Under a 2300W load, it delivers over 40℃ lower temperature compared with traditional heat dissipation solutions.

Far East Electric displays liquid cooling products at Booth A68

Server-level: Far East Electric provides a full portfolio of in-server liquid cooling modules and components including CPU, DIMM, GPU and manifolds. It meets heat dissipation demands of core heat-generating devices, supports holistic liquid thermal solutions and adapts to high-density computing deployment scenarios in data centers.

Far East Electric displays liquid cooling products at Booth A68

System-level: Rack-mounted/cabinet-type liquid cooling CDU covers heat exchange capacity from 16kW to 2000kW with 96%-98% overall heat exchange efficiency. It helps reduce the PUE of intelligent computing centers below 1.15, with temperature control accuracy within ±0.5℃, dual power switching within 100ms and N+1 full redundancy for core components.

Far East Electric Full-Chain Independent R&D, One-Stop AIDC Delivery

On-site, Far East Electric’s technical team held one-on-one in-depth discussions with customers and offered consultations on customized liquid cooling solutions. Evolving from a single-product supplier into a full-stack thermal management comprehensive solution provider, the company realizes one-stop delivery from chips to cabinets and computer rooms, with all core components self-developed.

Far East Electric’s full-stack AIDC liquid cooling solution has been deployed and verified in multiple computing center projects.

Far East Electric Three Core AIDC Solutions

The full-stack liquid cooling system solution covers from chip level to computer room level, suited for ultra-high-density computing clusters of 30kW–300kW+ per cabinet. It achieves 96%-98% overall heat exchange efficiency and helps lower PUE below 1.15.

The full-stack high-speed interconnection solution enables direct chip-to-chip links, covering full-scenario networking including Scale-Up in-cabinet vertical scaling, Scale-Out cross-rack horizontal scaling and Scale-Across inter-data-center interconnection to fully unleash the performance of high-density computing clusters.

The power transmission and distribution solution supplies a full range of products including low-voltage, medium-voltage, communication and waterproof cables to underpin the power transmission foundation of computing infrastructure.

The three solutions form a complete closed loop for AIDC infrastructure. All core components are independently developed to enable one-stop delivery spanning chips, cabinets and computer rooms.

Looking ahead, Far East Electric will keep focusing on core technological innovation for AI infrastructure. Together with industrial partners, we will build more efficient, reliable and sustainable intelligent computing infrastructure for global customers and jointly unlock unlimited possibilities in the intelligent era.