Backed by in-depth cooperation with leading global computing power companies (having obtained the scarce Vendor Code), Far East Electric has launched an integrated high-efficiency cooling solution of "bionic manifold microchannel cold plate + thermal interface composite material", which can significantly improve heat exchange efficiency, reduce pressure drop, and accurately suppress hot spot failure.

As ChatGPT generates analytical reports in seconds and Sora reconstructs physical world videos, the explosive growth of large AI models is reshaping all walks of life. Yet few notice that behind every intelligent breakthrough lies a "thermal crisis" — server power consumption in data centers is soaring, chip power has exceeded 2000W, and power equipment frequently malfunctions due to overheating. Thermal management has become a core bottleneck restricting the advancement of the AI Era. With the continuous surge in demand for AI computing power, the challenges of thermal management have long gone beyond "cooling down" itself, presenting a complex predicament of multi-dimensional interweaving: persistently high energy consumption has become an entrenched problem in the industry. Reports from the Organisation for Economic Co-operation and Development (OECD) show that the full-life-cycle energy consumption of large AI models exhibits a "snowball effect", and the International Energy Agency (IEA) even predicts that global data center electricity consumption will double by 2026. In the power sector, the energy consumption of temperature control systems for power equipment in China accounts for 18%-25% of the total energy consumption in the power transmission and distribution link, with annual power consumption exceeding 80 billion kilowatt-hours and still on the rise.

Faced with the industry predicament, Far East Electric has broken away from traditional heat dissipation thinking and innovatively proposed an integrated solution of "bionic manifold microchannel cold plate + thermal interface composite material". Inspired by biological heat dissipation mechanisms, this solution enables the cooling liquid to be rapidly and evenly distributed at the bottom of the chip through sophisticated design, greatly enhancing convective heat transfer capacity while significantly reducing pressure drop; the high thermal conductivity interface composite material is closely combined with microchannels to form an embedded thermal path synergy effect, effectively reducing interfacial thermal resistance and in-plane temperature difference, and accurately extracting heat from high-heat-generating areas.

Compared with the maximum heat dissipation capacity of 1000W of mainstream single-phase cold plates in the industry, Far East Electric's solution has achieved a major breakthrough in performance with lower pump energy consumption. Current test results fully meet the heat dissipation requirements of chips with GPU power exceeding 2000W. This technology not only features high heat dissipation capacity but also offers significant advantages such as low energy consumption and excellent temperature uniformity. It can be widely applied to key fields including next-generation GPU/CPU liquid-cooled accelerator cards, data center servers, high-power power electronics and RF chips, laying a solid foundation for the stable operation of computing power equipment. In addition, this technology is compatible with advanced packaging processes, demonstrating not only feasibility at the engineering implementation level but also enormous potential for large-scale application.

Far East has been deeply engaged in the power energy sector for over 40 years, and in recent years has gone "ALL IN AI", establishing "electric energy + computing power + AI" as its core strategy and carrying out in-depth layout. Currently, the company takes its wholly-owned subsidiary Far East Electric as the core business carrier, integrating high-quality resources in the field of AI computing power to provide customers with full-stack solutions from design and R&D to system integration. In September 2025, Far East Electric successfully obtained the Vendor Code from a leading domestic artificial intelligence chip enterprise, while advancing the testing and mass production preparation of next-generation chip liquid-cooled plates.

Competition in the AI Era is essentially a competition for core technologies, and thermal management technology is the "key deciding factor" hidden behind computing power. Far East Electric's thermal management solutions are fully empowering key fields, helping the industry break through heat dissipation bottlenecks and promoting China's manufacturing industry to occupy a core position in the high-end heat dissipation field.