From November 3 to 4, the 2026 (7th) International Conference on Liquid-Cooled Data Center Construction and Key Component Innovative Technologies was held in Dongguan, Guangdong. Far East Electric was invited to attend the conference, where it joined industrial chain enterprises and industry experts to discuss liquid cooling technology innovation and the development of high-density intelligent computing infrastructure. During the conference, Zhu Jiehua, Liquid Cooling Product Manager of Far East Electric, delivered a keynote speech titled Breakthroughs in Dual-New Liquid Cooling Technologies: Jet Microchannel and Liquid Metal Empower High-Density Intelligent Computing, sharing the company’s technological explorations in advanced heat dissipation structures, new thermal interface materials and full-domain liquid cooling solutions.

Far East Electric Addresses Computing Power Heat Dissipation Challenges and Explores the "Dual-New" Technology Path

As AI computing power infrastructure rapidly develops toward high density and high performance, heat dissipation efficiency, operational stability and energy utilization have attracted growing attention across the industry. In her keynote speech, Zhu Jiehua stated that to meet the continuously upgraded demands of intelligent computing, liquid cooling technology is evolving from optimization of individual components toward collaborative innovation in materials, structures and systems.

Aligned with this trend, Far East Electric shared its technological exploration of "new structures + new materials". Innovative liquid cooling structures are adopted to improve heat dissipation efficiency and temperature uniformity at critical heat sources. Meanwhile, the company explores the engineering application of new thermal interface materials to strike an optimal balance between heat dissipation performance, assembly convenience and long-term reliability.

Zhu Jiehua delivers the keynote speech

Far East Electric Focuses on "Dual-New" Innovation to Develop Efficient and Reliable Liquid Cooling Technologies

In terms of structural innovation, targeting the heat dissipation requirements of high-power chips, Far East Electric presented a technical approach combining jet cooling and bionic microchannels. By optimizing liquid flow and heat exchange paths, the solution mitigates local hotspots and uneven temperature distribution, offering more heat dissipation design options for high-density computing scenarios.

For material innovation, Far East Electric highlighted its R&D progress on structured liquid metal thermal interface materials. This technology addresses the pain points of traditional heat dissipation materials in interface matching and application reliability. Integrated material and structural design delivers high thermal conductivity, stability and practical assembly performance, advancing the engineering viability of advanced heat dissipation materials.

Far East Electric Builds Full-Domain Liquid Cooling Solutions Covering Chips to Systems

To meet thermal management demands at different levels of AIDC, Far East Electric showcased liquid cooling products and solutions spanning chips, servers, cabinets and system layers, including liquid cooling modules, coolant distribution units and supporting pipelines. For diverse computing, interconnection and power supply scenarios, the company can provide flexible product portfolios and customized services tailored to client requirements.

Stable manufacturing systems are essential from technology R&D to product rollout. Leveraging its precision manufacturing, quality control and system integration capabilities, Far East Electric keeps advancing application verification and delivery system development for liquid cooling products, striving to supply clients with reliable, highly adaptable thermal management solutions.

Far East Electric Connects Industrial Demands via Technological Innovation to Co-build AI Infrastructure

During the conference, Far East Electric exchanged views with industry participants on the development and application requirements of liquid cooling technologies. As an affiliate of FESC, Far East Electric focuses on high-speed interconnection, liquid cooling thermal management, energy storage batteries and power transmission, aiming to become a key technology partner for global AI infrastructure and intelligent interconnection.

Going forward, Far East Electric will continue to pursue innovation in materials, structures and systems for liquid cooling thermal management, deepen technical collaboration with industrial chain partners, and support the construction and green development of high-density intelligent computing infrastructure with more efficient and reliable products and solutions.