On October 27, the 2nd Phytium Platform Application Design Innovation Forum was held in Shenzhen. Jiang Xingfang, General Manager of the Liquid Cooling Business Unit of Far East Electric, was invited to attend the 2nd Phytium Thermal Dissipation Technology Industrial Application Development Seminar and delivered a keynote speech entitled Innovation of High-Efficiency Liquid Cooling Architecture for High-Power Chips: Full-Link Heat-Flow Solution from "Chip to Cold Plate". Centering on three major areas: thermal interface materials, cold plate structures and high thermal conductivity composite materials, he shared Far East Electric’s innovative achievements in thermal management for high-power chips. With the expanding application of high-power chips, heat dissipation systems are faced with more challenges than merely removing excess heat. Local hot spot control, efficient heat transfer between chips and cold plates, and matching of materials and packaging jointly affect the heat dissipation performance and operational reliability of the system.

To meet these demands, Far East Electric takes innovations in advanced materials and cold plate structures as the core, carries out optimization across three links: interfacial heat transfer, substrate heat conduction and fluid heat exchange, and explores a full-link thermal management solution from "chip to cold plate".

Far East Electric — Innovation of Interface Materials

The thermal interface between the structured liquid metal thermal interface material, chip and cold plate serves as a critical channel for outward heat transfer. Although conventional liquid metal boasts good thermal conductivity, it still encounters engineering challenges such as excessive fluidity, insufficient interface wetting and poor adaptability to thermal warpage.

To tackle these issues, Far East Electric has rolled out an innovative structured liquid metal TIM (Thermal Interface Material) solution. Adopting a composite design of elastic skeleton and liquid metal, it balances thermal conductivity, interface fitting and assembly reliability.

The composite structure constrains liquid metal to help reduce leakage risks; optimized interface wetting improves bonding between the material and contact surfaces and cuts contact thermal resistance. Meanwhile, the composite structure can adapt to thermal warpage and compensate for interface changes to support continuous heat transfer.

Matching practical assembly requirements, this solution features customizable melting points, low-pressure interface fitting and low-stress assembly. It better aligns material performance with engineering applications and delivers a reliable interfacial heat conduction path for high-power chips.

Far East Electric — Innovation of Cold Plate Structures

After heat passes through the interface, how to efficiently transfer heat to the cooling fluid via the cold plate is another key topic. For chips with high power and high heat flux density, cold plate design must take flow distribution, hot spot coverage and flow resistance into consideration simultaneously.

Far East Electric focuses on bionic manifold microchannels, combining special-shaped microchannels with U-shaped manifold structures. Diversion and flow-guiding designs optimize coolant distribution, enhance heat exchange in hot spot areas and improve temperature uniformity.

This design optimizes fluid paths according to the heat distribution of chips, boosting heat exchange performance while controlling flow resistance, and provides new ideas for structural optimization of cold plates for high-power chips.

On this basis, Far East Electric further conducts research on collaborative heat dissipation of cold plate structures and TIM materials. It comprehensively optimizes interfacial heat transfer and fluid heat exchange within the same heat transfer path, shifting heat dissipation design from improvement of individual components to full-link coordination.

Far East Electric — Innovation of Substrate Materials

Apart from interfaces and flow channels, the heat conduction and diffusion capacity of the cold plate substrate itself also affects heat transfer in hot spot zones.

Diamond-copper composite material integrates the merits of diamond and copper matrix, featuring high thermal conductivity, adjustable coefficient of thermal expansion and low density, offering a new material option for improving cold plate performance. By carrying out combination verification of different cold plate substrates and thermal interface materials, Far East Electric keeps exploring the application potential of diamond-copper cold plates and accumulating technical reserves and experimental data for thermal management of high-power chips. From structured liquid metal for improved interfacial heat transfer, to bionic manifold microchannels for optimized fluid heat exchange, and diamond-copper composite materials for enhanced substrate thermal conductivity, Far East Electric continues to advance collaborative innovation in materials, structures and engineering applications along the heat transfer path of high-power chips.

The sharing at this forum demonstrates Far East Electric’s systematic thinking on heat dissipation requirements of high-power chips and provides a reference for industrial partners to exchange liquid cooling technologies and application practices.

Facing the development demands of high-density computing power infrastructure, Far East Electric will further deepen research on advanced thermal management technologies, strengthen exchanges and cooperation with industrial chain partners, promote verification and application of innovative solutions, and provide thermal management support for stable operation of high-power chips and the construction of computing power infrastructure.