Designed for high-density optical interconnects in AI data centers, the XPO Optical Module Liquid-Cooling Solution provides precise thermal management for high-speed optical modules. Independent flow paths and advanced heat-spreading structures improve temperature uniformity and reliability for next-generation high-bandwidth networking systems.

Core Advantages

• Independent Dual-Sided CoolingSeparate upper and lower coolant paths enable targeted thermal control across optical-module surfaces
• Enhanced Microchannel Heat TransferTurbulence features and stepped channels can improve the heat-transfer coefficient by more than 20%
• High-Conductivity Heat SpreadingDiamond-copper composite material with 700–900 W/m·K thermal conductivity helps reduce spreading resistance and hot spots
• Flexible Flow-Path IntegrationTotal flow resistance of ≤60 kPa helps improve coolant-distribution efficiency
• Comprehensive Reliability Validation Multiple channel orientations support complex optical-module layouts and system-level mechanical requirements

Application Scenarios

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  12.8T Optical Systems

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  High-Density Networking

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  AI Training Clusters

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  AI Data Centers