Designed for high-density AI servers and HPC platforms, this multi-chip liquid-cooling module provides coordinated cooling for CPUs, GPUs, and voltage-regulation components. Its integrated cold-plate architecture enables efficient heat removal across multiple high-power devices, supporting sustained full-load performance and reliable server operation.

Core Advantages

• High Thermal-Load Capacity Supports a 550 W CPU plus four 500 W GPUs under full load, with CPU case temperature ≤55°C and GPU temperature ≤75°C
• 10 Bar Pressure Rating Designed for demanding liquid-cooling environments with typical operating pressure around 3.5 bar
• Precision Thermal Interface Primary chip contact-surface flatness of ≤0.05 mm supports efficient heat transfer across multiple devices
• Low System Flow ResistanceTotal flow resistance of ≤60 kPa helps improve coolant-distribution efficiency
• Comprehensive Reliability ValidationPressure-hold, pressure-pulse, thermal, flow, leakage, and environmental testing support long-term operation

Application Scenarios

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  Multi-GPU AI Servers

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  HPC Systems

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  AI Training Clusters

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  AI Data Centers