Designed for high-power processors and AI accelerators, Structured Liquid Metal TIM creates an ultra-low-resistance thermal path between the chip and heat sink. Its supported liquid-metal structure combines excellent surface conformity with improved material control, enabling efficient and reliable heat transfer in high-heat-flux computing applications.

Core Advantages

• High Thermal ConductivityDelivers 60–100 W/m·K thermal conductivity with interface thermal resistance as low as 0.04 K·cm²/W
• Controlled Phase-Change PerformanceConfigurable melting point enables solid-state handling and liquid-state operation for improved interface conformity and material control
• Low Assembly PressureRequires ≤10 psi mounting pressure, helping reduce mechanical stress on high-value chips and packages
• Long-Term StabilityResists drying, aging, and volatilization for reliable operation across demanding temperature and workload conditions

Application Scenarios

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  AI Servers

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  AI Accelerators

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  HPC Systems

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  High-Power CPUs&GPUs&ASICs