Designed for high-performance switching platforms in AI clusters, the Switch Liquid-Cooling Solution delivers efficient heat removal for high-power switching ASICs beyond conventional air-cooling limits. Advanced microchannel cooling and high-performance heat spreading help maintain stable network performance in dense 400G/800G and next-generation switching environments.

Core Advantages

• 1,200 W+ ASIC CoolingExtends thermal capability beyond conventional air-cooling limits for next-generation switching silicon
• High-Performance Biomimetic Microchannelsmaintaining low flow resistance, improving cold-plate cooling capacity by up to 150%
• Advanced Heat SpreadingDiamond-copper composite material with 700–900 W/m·K thermal conductivity helps suppress localized hot spots
• Ultra-Low-Resistance Thermal PathStructured liquid-metal interface technology can reduce chip temperature rise by up to 65% and support heat sources in the 2,500 W class

Application Scenarios

• 

  High-Performance Switching

• 

  400G/800G Switches

• 

  AI Cluster Networking

• 

  Data Center Networks