Designed for liquid-cooled AI racks, the Rack-Level Coolant Manifold provides reliable and balanced coolant distribution across multiple server nodes. Its modular architecture, low flow imbalance, and service-friendly connections support fast deployment, simplified maintenance, and consistent rack-level cooling performance.

Core Advantages

• Compact Rack-Level IntegrationDesigned for installation within 1U–2U rack space to support independent rack deployment
• Balanced Coolant DistributionOptimized piping topology keeps branch-flow non-uniformity below 10%, reducing hot-spot risk across the rack
• Service-Friendly ConnectionsDiamond-copper composite material with 700–900 W/m·K thermal conductivity helps suppress localized hot spots
• Clean, Reliable Construction304 stainless steel and EPDM components undergo deionized-water flushing, drying, and factory pressure testing for dependable operation

Application Scenarios

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  Rack‑Level Coolant Distribution

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  High-Density AI Racks

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  GPU Clusters