Asian AI Computing Power Industry and Data Center Exhibition of the 28th China Hi-Tech Fair

Held from November 26 to 28, 2026, the Asian AI Computing Power Industry and Data Center Special Exhibition, a highlight of the 28th China Hi-Tech Fair known as "China’s No.1 Tech Fair", features computing-power and power coordination as its core attraction. Breaking the traditional single-product exhibition model, the event builds a full-chain ecosystem platform covering "computing power + power supply + energy storage + intelligent scheduling". It facilitates collaborative innovation among upstream and downstream enterprises, explores the coexistence pathway for digital infrastructure and new power systems, and serves as a critical industrial matchmaking platform for fostering new-quality productive forces and delivering carbon peaking and carbon neutrality goals.

Far East Electric Co., Ltd. focuses on addressing core challenges in AI data centers (AIDC), robotics and smart mobility, delivering full-stack solutions from R&D design to system integration. The company will showcase its liquid cooling thermal management and high-speed interconnection solutions tailored for AIDC scenarios at the Asian AI Computing Power Industry and Data Center Exhibition of the 28th China Hi-Tech Fair during November 26–28. You are warmly welcome to visit our booth for discussions and business talks.

Product Introduction

Liquid Cooling Thermal Management

The "Dual Innovation" liquid cooling module integrates jet impingement cooling, bionic-structure cold plates and structured liquid metal TIM thermal interface materials. It optimizes heat transfer from both cold plate heat exchange and interface thermal conduction to provide heat dissipation support for high heat-flux chips.

Matching rack-mounted and cabinet-type CDUs, manifolds and prefabricated pipelines are available to meet multi-level demands ranging from chips to computer rooms. The CDU covers a heat exchange capacity of 16–2000 kW with temperature control accuracy up to ±0.5℃. The coordinated design of components and pipe networks improves system adaptability and deployment efficiency.

Our high-speed interconnection portfolio includes server storage, external high-speed, chip-to-I/O and backplane connectors and assemblies. It complies with standards such as PCIe and CXL, supports PCIe 6.0 performance, and offers high-speed interconnect solutions for 112G-related standards. Collaborative design targeting signal loss, connection density and structural adaptability ensures stable data transmission among chips, boards and servers.

We concentrate on AI infrastructure and intelligent interconnection. By continuously advancing technological innovation and product development, we build comprehensive capabilities covering high-speed interconnection, liquid cooling thermal management and system solutions. We precisely cater to diversified requirements of global customers, consistently create value with professional, efficient and reliable services, and help customers achieve greater breakthroughs and long-term growth.